Next generation ultra-high-speed microwave Photonic integrATed circuiTs using advancE hybRid iNtegration

PATTERN will develop world’s first process design kit (PDK) for microwave photonics at ultra-high frequencies above 100 GHz as well as bringing new functionalities into PIC such as magneto-optics isolators and acousto optics modulators (AOM). PATTERN’s approach to ultra-high frequencies is holistic and includes all the aspects such as design and simulation, generation, detestation, modulation, and packaging. To achieve this goal, we propose a massive hybrid integration of several different PIC platforms such as InP and LNOI but also including new materials such as Yttrium Iron Garnet (YIG). We also develop co-integration of electronic SiGe chips with PICs which especially a necessity in ultra-high speeds.

LNOI is of the most promising emerging materials for PICs that comprises a unique set of interesting optical properties: a high electo-optic coefficient, a high intrinsic 2nd-order nonlinearity, and a large transparency window which makes it ideal for electronics manipulation of light at many wavelengths (EO modulation). InP is an ideal platform for generation and detection of light and YIG is a known magneto-optics material. If put together, truly novel, and advanced functionalities and opportunities arise.

In addition, in PATTERN we develop packaging solutions and for such high frequencies which one of the main barriers in this field. Moreover, we also develop software expertise for design automation (e.g. RF signal routing) and end-to-end circuit simulation and design which is extremely challenging at these frequencies. We also demonstrate the capabilities of the platform in 6 different application-oriented prototypes.

PATTERN puts together the expertise of 11 well known SMEs, RTOs and industrial players to achieve these objectives in 54 months project. Once developed, PATTERN will pave the way for the new generation of advanced PIC products in wide range of applications from telecom, 5G/6G to quantum technologies, LiDAR and sensing.